Characterization of a New Copper Paste for Printed Electronics

Printed electronics can be considered as an additive manufacturing technique allowing the fabrication of circuits and devices such as sensors, MEMS, LEDs, etc. An important research subject in this field is identifying new materials exhibiting low resistivity. In this article, we present a new copper paste interesting for structural electronics, based on additive manufacturing and laser activation. We characterized the structure of this copper paste after laser activation, by SEM, EDS, and FTIR. We also used four probe method to characterize sheet resistance to obtain a resistivity as low as 10 -7 Ω.m, and compared it to other commercial conductive pastes.